Tongfu Microelectronics (002156.SZ) — market event timeline
NashNova tracks 4 market events mentioning Tongfu Microelectronics (002156.SZ) between 2026-06-25 and 2026-07-05, each with a dated one-line analysis of how the event relates to the asset.
- Huawei Releases First "Tao Chip" Kirin 2026 Benchmark Data
Core advanced packaging supplier with TSV and 2.5D packaging capabilities, directly benefiting from Huawei's packaging and testing expansion cycle.
- ASE Advanced Packaging Prices Rise Up to 20%
Core advanced packaging supplier for AMD; ASE's price increase confirms capacity shortage, benefiting its expansion and pricing power.
- Goldman Sachs Raises JCET Group Target Price to 125 Yuan, Maintains Neutral Rating
Domestic advanced packaging peer. Goldman Sachs' valuation framework shift for JCET may transmit broader revaluation expectations across the OSAT sector.
- JCET Plans to Invest 7.8 Billion Yuan to Build Advanced Packaging Facility in Shanghai Lingang
China's second-largest OSAT company. JCET's massive capacity expansion will intensify competition in the advanced packaging segment, directly affecting its market share outlook.
For research and information only — not investment advice.