TSMC 2nm/CoWoS/CoPoS Drives Supply Chain Boom: Multiple Taiwanese Firms Post Record-High Revenue in First Five Months

Claire Weston
Published todayAbout 12 min read

TSMC's ramp in advanced nodes and packaging is pulling equipment, materials, and construction orders across the entire supply chain — multiple Taiwan suppliers posted all-time-high revenue through May. This means the AI investment wave has moved well beyond the foundry itself into every upstream link.

01

Who locked in the most certain orders?

Scientech has officially entered TSMC's next-generation CoPoS — panel-level packaging, scaling chip packaging from wafer size to panel size for higher throughput and lower cost — equipment supply chain. Order visibility extends to 2028.
Cumulative revenue through May hit NT$5.08 billion, a record for the period. In-house equipment is expected to exceed 50% of total revenue in coming years, at higher margins than distributed gear. This means → Scientech is shifting from "reselling others' tools" to "selling its own," upgrading its profit structure.
Facility-engineering firm UIS posted NT$37.613 billion in revenue through May, up 83.4% year-on-year. Its backlog stands at NT$193.937 billion, with visibility to 2030. In plain terms = the contracts already signed are enough to keep UIS busy through the end of the decade.
02

Are materials and consumables keeping up?

Polishing-consumable supplier Kinik reported May revenue of NT$829 million, its second-highest month ever. Through May, cumulative revenue reached NT$3.952 billion, up 24.52% year-on-year, with all three product lines growing — CMP diamond discs (abrasive pads used to polish chip surfaces) led the way.
AMC's balance film — a thin-film material applied to packaging substrates to prevent warping — has cleared customer qualification and is expected to enter mass production in H2 2026, covering WLP, PLP, and glass-substrate packaging.
Some advanced packages require multiple coats of balance film, driving both volume and average selling price higher. This means → it is not just shipment count rising; each chip consumes more material, giving materials suppliers a volume-and-price tailwind.
03

Where do automation equipment and new-tech bets stand?

Allring is riding CoWoS expansion and silicon photonics (SiPh — chip technology that transmits data with light instead of electrical signals, enabling higher speed at lower power). Revenue through May rose 23.56% year-on-year.
The company is positioning across SoIC and CoPoS dispensing tools, SiPh metrology and coupling instruments, high-speed telecom test equipment, and advanced thermal products, while entering panel-level packaging (PLP). CPO equipment is set to begin shipping in Q4 2026.
This reflects a strategic shift among equipment makers: from "excel at one tool" to "stake out every step on TSMC's packaging roadmap" — the broader the process coverage, the deeper the lock-in.
04

How long can the construction boom last?

UIS signed NT$67.414 billion in new contracts through May, driven by TSMC and Micron accelerating fab builds in Taiwan and overseas.
YKE benefits from Micron's STSP fab, ASML projects, data-center builds, and overseas construction moving in parallel. After formally entering the supply chain of a major international memory maker, its overseas footprint is expected to keep expanding, with strong H2 2026 performance.
In plain terms = the construction wave is not a one-time pulse — TSMC and Micron's expansion plans run through 2030, and facility engineers' order books are the thermometer for this cycle.
05

What is the biggest uncertainty in the CoPoS supply chain?

TSMC has launched its first CoPoS pilot line at the VisEra Longtan fab. Suppliers participating in qualification must sign NDAs; some core suppliers face exclusive-supply clauses.
Specifications are not yet fully standardized: TSMC uses a 310 mm × 310 mm panel size, but other customers require different dimensions, forcing suppliers to qualify separately for each.
This means → CoPoS has moved from the NDA-qualification phase into actual order placement, but whether mass-production yields deliver is the real test of these suppliers' earnings durability — a signed order is not the same as profit in the bank.

Content is for reference only, not financial advice.

TSMC 2nm/CoWoS/CoPoS Drives Supply Chain Boom: Multiple Taiwanese Firms Post Record-High Revenue in First Five Months · nashnova