Jensen Huang: Robotics Will Be Korea's Next Core Industry
nashnova research
Nvidia CEO Jensen Huang landed in Seoul for his second Korea visit in seven months, promising a 'surprise' and projecting second-half AI infrastructure spending far above the first half — while naming robotics as Korea's next core industry and personally denying HBM cutback rumors.
What is the 'surprise' Huang is teasing?
He told reporters at Gimpo Airport that this trip would "bring a surprise" but refused to share any details.
He offered his clearest scale forecast yet: AI infrastructure build-out in H2 will far exceed H1, and "next year will be very, very large."
This means → Nvidia's read on compute demand is still accelerating, not peaking — the "surprise" most likely involves a new product or partnership.
Why call robotics Korea's 'next core industry'?
Huang argued that Korea's strengths in mechatronics manufacturing, semiconductors, and AI give robotics "an extremely perfect foundation."
In plain terms = Korea can build precision hardware, make chips, and train models — stack all three and you have the full toolkit for building robots.
Nvidia has begun recruiting for a Korean R&D center and plans to build a campus once the team reaches scale — this signals Nvidia is upgrading Korea from "supplier" to "R&D partner."
Is Nvidia really cutting back on HBM?
Huang denied the market rumor head-on: "We will use a lot of high-speed memory," he said.
He acknowledged supply is genuinely constrained, forcing Nvidia to use memory "more scientifically and wisely" across all systems.
This means → Total HBM demand is not shrinking; the real bottleneck is on the supply side — Nvidia wants more, not less.
Where do the three memory suppliers stand?
Huang confirmed that all three memory suppliers backing the Vera Rubin architecture — Nvidia's next-generation AI chip platform — have passed qualification and entered mass production.
Samsung Electronics and SK Hynix together supply roughly 70% of the memory in Nvidia's AI chips; both are among the three.
On whether next year's HBM will use hybrid bonding — a process that joins two chips face-to-face — he said "we're not sure of next year's plan yet; we'll let everyone know the moment we are."
What else is on the itinerary?
Huang will meet executives from Hyundai Motor, LG, SK Hynix, Samsung Electronics, and Naver.
Reuters reported he plans to dine that evening with LG Chairman Koo Kwang-mo, SK Chairman Chey Tae-won, and Naver founder Lee Hae-jin — three of Korea's top conglomerate chiefs at one table.
He also mentioned RTX Spark, calling it "the first complete redesign of the PC in 40 years," hinting at further announcements during the Korea visit.
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