Mass Production Race for Glass Substrates Begins, Intel Fights for the First Global Seat

The surge in AI computing power demand is reshaping the advanced packaging supply chain, with the strategic value of glass substrates sharply highlighted — whoever achieves mass production first will gain an early lead in the next generation of high-end packaging markets.

According to tech media TrendForce, as reported by Forbes, Intel's factory in Rio Rancho, New Mexico, is expected to become its first mass production base for glass substrates and may claim the title of the world's first mass production facility. This factory has previously taken on the main production tasks for Intel's EMIB advanced packaging and Foveros 3D chip stacking, with glass substrates currently supplied in small quantities through the Chandler pilot line. The establishment in Rio Rancho will mark the official transition of the technology towards large-scale implementation. Intel has also disclosed prototypes of the first glass substrates equipped with integrated optical interconnect technology, with a commercialization goal set for 2030.

The preference for glass substrates is fundamentally due to the bottleneck of traditional organic substrates. Under the demand for larger-sized packaging by AI accelerator chips, traditional ABF substrates are prone to warping during the heating process, thereby reducing integration yield rates; whereas glass, with its higher surface flatness and thermal expansion coefficient closer to that of silicon materials, becomes the ideal alternative for high-density interconnect packaging.

Intel is not the only competitor. South Korea's SKC subsidiary, Absolics, is expected to start commercial production by the end of this year, holding a significant first-mover advantage in terms of schedule; Samsung Electro-Mechanics is currently operating a pilot line at its Sejong factory, aiming for mass production after 2027; China's panel giant BOE is cooperating with Corning from the United States to accelerate the layout of glass substrate related businesses.

From a competitive perspective, if Absolics can land on schedule, it will be the first to verify the feasibility of scaling up glass substrates; Intel's differentiation lies in the deep integration of glass substrates with optical technology, and relying on existing foundry customers such as AWS, Cisco, and potential cooperation with giants like Apple and Nvidia, to build a clearer demand support.