Samsung First to Ship Industry's First Batch of HBM4E Samples, Reinforcing AI Storage Leadership

Samsung Electronics officially delivered the industry's first 12-layer stacked HBM4E samples to its global core customers, continuously leading the high-end AI high-bandwidth memory track.

This delivery of HBM4E samples is another product iteration by Samsung following the mass production and commercialization of HBM4, completing the high-end AI storage product matrix. The performance and capacity upgrades of HBM4E can accommodate large language models and the next generation of AI systems, further strengthening Samsung's industry discourse power.

Significant performance iteration and enhanced AI compatibility

According to official disclosures, the stable pin speed of HBM4E can reach 14Gbps, with peak performance expandable to 16Gbps. This core rate is over 20% faster than the previous generation HBM4 products, capable of carrying high-density and high-intensity data processing needs in the AI field.

Relying on the rate upgrade, the memory bandwidth of a single HBM4E stacked product can reach up to 3.6TB/s, greatly releasing the potential of AI device computing power.

Expansion of storage capacity, continuous enrichment of the product line

The 12-layer stacked HBM4E samples shipped this time come with a standard 48GB storage capacity, an increase of over 30% compared to the previous generation products. Samsung plans a multi-version product layout, and will later introduce 8-layer 32GB and 16-layer 64GB configurations of HBM4E.

The multi-tiered capacity layout can meet the differentiated needs of different scales of AI computing centers and large-scale infrastructure.

Continuous technological iteration, positioning in the global AI storage core market

Since this year, Samsung has been the first to complete the mass production and commercial shipment of HBM4, continuously refreshing industry technical standards.

Hwang Sang-joon, Executive Vice President of Samsung Electronics and head of memory R&D, said the company will continue to drive global AI storage market growth based on manufacturing and infrastructure advantages.

Market analysis believes that Samsung's successive landing of HBM4 and HBM4E technological iterations will further widen the technological gap with peers, solidifying its monopoly advantage in the high-end HBM market, while precisely matching the upgrade needs of global AI computing infrastructure.