TSMC Develops EMIB-Like Packaging Technology to Counter Intel Competition
Taylor Wilson
TSMC is developing an advanced packaging technology resembling Intel's EMIB and has discussed it with select customers. With AI packaging capacity stretched thin, Intel is winning orders from Nvidia and Google — and TSMC needs an answer.
What is TSMC building, and why now?
According to *The Information*, citing two people familiar with the matter, TSMC is internally developing a new packaging technology it calls "EMIB-like," and has already discussed it with some customers.
This means → TSMC acknowledges a gap in its packaging roadmap and is moving to match a path Intel has already proven.
TSMC has partnered with Taiwanese substrate maker Foxsemicon (京鼎精密科技) to advance the project. Foxsemicon builds the substrate — the base layer that carries signals between chips and the rest of the server.
What exactly is EMIB, and why is Intel winning clients with it?
EMIB — embedded multi-die interconnect bridge — works by embedding small silicon bridges inside the package substrate, placing them only where the fastest connections are needed rather than laying every chip on one shared layer.
In plain terms = TSMC's current CoWoS approach is like "placing all chips on one large mat." EMIB is like "building small bridges only at critical junctions" — more flexible for assembling large, complex designs.
That flexibility is drawing major customers: Nvidia is evaluating EMIB for a future processor integrating four graphics chips; Google has ordered Intel to package more than 3 million custom AI processors by 2028.
How tight is TSMC's packaging capacity?
TSMC CEO C.C. Wei said on this month's earnings call that advanced packaging capacity is extremely strained and is constraining customer growth.
This means → even customers who prefer TSMC may be forced to turn to Intel simply because slots are unavailable. Intel gains not just packaging revenue but a window to demonstrate capability and deepen relationships.
In plain terms = the capacity crunch hands Intel a "free sample" pass — once a customer's packaging runs smoothly on Intel's line, wafer-fabrication orders may follow.
How far along is the EMIB-like project?
People familiar with the project say it is still in its early stages; a timeline for commercial production remains unclear.
TSMC declined to comment; Foxsemicon did not respond to a request for comment.
This reflects a critical timing question: if TSMC cannot bring EMIB-like packaging to market before Intel further locks in packaging relationships, its dominance in advanced packaging faces real erosion.
Content is for reference only, not financial advice.