MIIT Releases 15th Five-Year Plan for Electronic Information Manufacturing, Targeting 30 Trillion Yuan Revenue by 2030
nashnova research
China's MIIT and NDRC jointly released the 15th Five-Year Plan for electronics manufacturing, setting a ¥30 trillion revenue target and a 3.5% R&D intensity goal by 2030 — formally placing chip self-sufficiency and advanced computing at the center of the next five-year industrial agenda.
How big is the ¥30 trillion target?
The plan targets aggregate revenue above ¥30 trillion for above-scale electronics manufacturers by 2030, with R&D intensity reaching 3.5%.
This means → at 3.5%, the industry's annual R&D spending alone would exceed ¥1 trillion — a figure rivaling the entire GDP of some mid-sized economies.
In plain terms = Beijing is saying the sector must not just grow in size but spend heavily on the ability to build things itself. R&D intensity measures exactly that: how much money goes into technology development.
Integrated circuits come first — what does the plan cover?
The plan lists integrated circuits as the top priority, spanning high-performance processors, high-density memory, advanced packaging and testing, wide-bandgap semiconductors — chip materials that work under extreme heat and voltage — and EDA tools (electronic design automation, the software used to design chips).
It also requires improving domestic supply of critical equipment, materials, and components.
This means → from design software to manufacturing equipment to packaging, the plan demands full-chain controllability, not breakthroughs at a single node.
What problem is the advanced-computing push trying to solve?
The plan calls for a heterogeneous computing architecture — making CPUs, GPUs, and specialized chips work together — and for developing micro-architectures purpose-built for AI large-model training and inference.
Key technologies to break through include distributed computing, high-bandwidth memory pooling, all-optical switching — routing data between servers with light instead of electrical signals — and liquid cooling.
It also lays out next-generation computing paradigms: computing-in-memory (putting processing and storage on the same chip to cut data movement), quantum computing, and optical computing.
In plain terms = AI models keep getting bigger, and the current computing stack cannot keep up. This plan says China intends to redesign how computing power is assembled, starting at the chip-architecture level.
What is new for consumer electronics and photonics?
On consumer electronics, the plan pushes faster AI-driven upgrades for smartphones, PCs, VR headsets, and wearables, along with spatial computing, display optics, and sensing-interaction technologies.
It specifically calls for making consumer electronics age-friendly — This reflects policymakers beginning to factor an aging society into product-design requirements.
Photonics gets its own dedicated section: developing photonic design automation software, building micro-nano fabrication and opto-electronic integration platforms, and pushing photonic technology into AI, telecom, industrial manufacturing, and healthcare.
Can the target be met? What is the deciding factor?
The plan itself acknowledges that hitting the ¥30 trillion revenue target depends on two things: the pace of integrated-circuit self-sufficiency and the speed of substantive breakthroughs in the advanced-computing ecosystem.
This means → the policymakers behind this plan know that writing a target is not the same as reaching it. Chips and computing power are the hardest bottlenecks, and the speed of progress there determines everything else.
In plain terms = this plan is both a roadmap and an exam paper — ¥30 trillion is the target score, and chip self-sufficiency is the hardest question on the test.
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