Xiaomi Unveils Three In-House Chips; Xuanjie O3 Becomes First Android SoC to Break 5 Million in Benchmark Scores
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Xiaomi on August 25 unveiled three in-house chips in one event — mobile processor O3, on-device AI accelerator O100, and autonomous-driving chip D100 — with the O3 posting an AnTuTu score above 5.22 million, a first for any Android SoC. This means → Xiaomi is shifting from a phone maker that buys chips to a platform company that designs its own silicon.
What does O3's benchmark score actually tell us?
Xuan Jie O3 is built on TSMC's 3 nm process and scored 5.22 million on AnTuTu — the first Android mobile processor to break the 5-million mark.
Its CPU uses a ten-core, all-big-core design with a peak clock of 4.35 GHz. Single-core score: 3,945; multi-core: 15,221 — a 60% jump over the previous O1.
The GPU debuts a 16-core graphics processor, delivering 85% more performance than O1 while cutting power draw by 64%. This means → the same game visuals burn barely a third of the battery the last generation needed.
The NPU delivers 200 TOPS of tensor compute — 2.2× the O1 — and vector compute rises 6.8×. In plain terms = the on-device "muscle" for running AI models has more than doubled.
Why call out memory and cache separately?
O3 is the world's first mobile processor to support LPDDR6 — the next-generation mobile memory standard offering wider bandwidth and lower power. Per-channel bit width expands from 16 to 24 bits.
Peak transfer bandwidth hits 113.8 GB/s, up 48% from O1. On-chip cache totals 60 MB, with static access latency as low as 82 ns — 32% lower than O1.
This means → raw compute is useless if data cannot reach the cores fast enough; O3's edge is in how fast it feeds itself.
Launching on a foldable — are the shipment targets enough?
O3 has entered mass production and will debut next month on the Xiaomi 18 Fold foldable and the Pad 9 Pro Max tablet.
DIGITIMES reports a shipment target of 200,000–300,000 units for the 18 Fold. The number is modest, but it is the first real test of O3's production ramp.
For context, Huawei shipped 1.6 million foldables in China in Q2 2026, holding a 68% share; Honor and OPPO followed at 13.7% and 8.5%. In plain terms = Xiaomi's in-house chip is entering territory Huawei dominates, and 200,000 units is just a foot in the door.
Since the first-gen O1 launched in May last year, devices carrying it have shipped over 1 million units total, including roughly 150,000 smartphones.
What bottleneck does the O100 solve?
Xuan Jie O100 targets on-device AI acceleration. Built on TSMC's 6 nm process, it uses 3D wafer-level vertical stacking — sandwiching two DRAM wafers onto one compute wafer — to push memory bandwidth to 1.22 TB/s, 16× faster than flagship-phone LPDDR5X.
The hybrid-bonding interface — joining two chips directly, face-to-face — contains 2.58 million nodes at a 1.4 µm pitch.
Running a 3-billion-parameter model on-device, O100 delivers 330 tokens per second. This means → a phone can run a small AI large-language model locally at high speed, with no need to reach the cloud for every query.
O100 has completed die-return validation and is expected to enter commercial use in 2027. Xiaomi's team spent roughly six months iterating chip layouts to solve wafer warping during high-temperature bonding.
D100 — why is a phone maker building a driving chip?
Xuan Jie D100 is China's first 3 nm autonomous-driving chip, packing a 20-core CPU, a 16-core NPU, and up to 160 GB of unified memory — enough to deploy models with up to 200 billion parameters locally.
Multiple D100s can be daisy-chained via Xiaomi's proprietary high-speed interconnect. This reflects a goal beyond a single chip: Xiaomi is building a scalable compute platform.
Xiaomi also showed an AI Cube prototype integrating O3 + O100 + D100, running a 120-billion-parameter model and a 3B model locally for tasks like web coding and game development.
D100 is also targeted for 2027 commercial launch, but must first clear automotive-grade certification, functional-safety validation, and large-scale road testing.
Behind three chips — what is Xiaomi really betting on?
The three chips were developed over three years by roughly 3,000 engineers, all fabbed by TSMC — making TSMC the central manufacturing partner for Xiaomi's custom-silicon strategy.
Xiaomi's phone business is under pressure: 65 million units shipped in H1 2026 at an ASP of ¥1,329, versus 84 million units at ¥1,141 a year earlier. Volume shrank, but ASP rose.
This means → Xiaomi is trading volume for price — selling fewer but pricier phones. Whether its in-house chips can drive foldable volumes and then spread across more product lines is the pivotal test of whether this R&D bet converts into commercial payoff.
Content is for reference only, not financial advice.